Taiwan based popular chip manufacturing company MediaTek has recently announced the Dimensity 8400 SoC, a premium smartphone chip with support for powerful Gen-AI performance in it's class. The company has confirmed the launch of this SoC on a recent press release. If you are paying close attention to their product related news, you may have known by now that MediaTek launched the Dimensity 9400 earlier back in early October of 2024.
This SoC is part of their "all big core" design with a powerful NPU to accelerate AI tasks along with MediaTek's new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI application. This chip is produced using TSMC's advanced 4nm process.
It includes an eight-core Arm Cortex A725 processor with a clocking speed up to 3.25 GHz which provides 41% higher multi-core performance compared to it's previous generation Dimensity 8300 chip. While comparing with 8300, MediaTek claims 8400 chip to be 44% more power efficient at peak power usage. It has doubled it's L2 cache and increased 50% more L3 cache and 25% more SLC cache.
As far as the graphics engine is concerned, this SoC includes Arm Mali -G720 MC7 GPU which provides 24% more peak performance and it is 42% more power efficient than earlier 8300 chip. The 8400 uses the MediaTek NPU 880 that offers state of the art Gen-AI capabilities for translations, rewriting contextual reply, AI recording, media generation and much more. It supports mainstream LLM/SLM/LMMs.
The built-in Imagiq 1080 technology achieves exceptional photography and video recording quality, with flagship-grade HDR image and and video content. This chip also includes MediaTek's more advanced 5G modem which can transmit up to 5.17Gbps of data over cellular networks.
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